3D integrated circuits are attractive options for overcoming the barriers in interconnect scaling, offering an opportunity to continue the complementary metal-oxide-semiconductor performance trend. This workshop brings together researchers, practitioners, and industry experts to exchange ideas and discuss the latest state-of-the-art innovations and future challenges.

 

Senior Personnel:	Prof. Hai (Helen) Li (PI), Jonathan Chao (co-PI), and Yuan Xie (co-PI)
Sponsors:	New York University Abu Dhabi
Team Members:	N/A
Collaborators:	N/A
Performance Date:	04/18/2012 – 04/19/2012

 

Related Publications: N/A