3D integrated circuits are attractive options for overcoming the barriers in interconnect scaling, offering an opportunity to continue the complementary metal-oxide-semiconductor performance trend. This workshop brings together researchers, practitioners, and industry experts to exchange ideas and discuss the latest state-of-the-art innovations and future challenges.
|Senior Personnel:||Prof. Hai (Helen) Li (PI), Jonathan Chao (co-PI), and Yuan Xie (co-PI)|
|Sponsors:||New York University Abu Dhabi|
|Performance Date:||04/18/2012 – 04/19/2012|
Related Publications: N/A